Grinding Stone for Printed Circuit Board
Polishing of ceramic substrates GDNW
【feature】
No clogging of holes.
Very high grinding power for resin and copper plating.
Abrasive layer is thicker and has longer life.
Polishing performance is stable over the long term.
Polished surface is smooth.
No scratching due to polishing.
| Category | Mainstay |
| ＧDNW | GC |
| Grinding Stone size | vertical 12mm | height12mm |
| beside 12mm | Pitch Bottom 1 mm Top 4 mm |