Elastic Grinding Stone for Printed Circuit Board

New type of buff EGSW replaces non-woven buff

The new material replaces non-woven buffing and solves all the problems that occur with conventional non-woven buffing.
・ Removal of burr from holes before plating to eliminate clogging and dripping
・ Demonstrates good tracking and grinding power in the removal of coarse particles after plating
・ Long life and reduced waste by eliminating the need to replace wheels

【Application】
・Deburring and surface polishing before plating
・Pre-treatment polishing of laminate
・Hole filling ink and conductive paste polishing
・Spring Resin Polishing
・Stainless steel mirror plate polishing