Grinding Stone for Printed Circuit Board

■Ceramic Buffing CGSW

【Application】
・Polishing of hole-filling ink resin
・Substrate Surface Protrusions Polishing
・Substrate leveling and polishing
・Polishing of blackening shop coatings
・Deburring and polishing
・Polishing of ceramic substrates

No clogging of holes.
Extremely high grinding power for resin and copper plating. Abrasive layer is thick and has long life.
Polishing performance is stable over the long term.
Polished surface is smooth. No scratching due to polishing.